柔性电子技术(英文)(FlexTech)(国际期刊)(OA期刊)(可官网投稿)

《柔性电子技术(英文)》(FlexTech),杂志于2024年创办,经新闻出版总署批准的正规刊物,由清华大学主办、清华大学柔性电子技术实验室提供学术支持、清华大学出版社编辑出版、Wiley出版集团海外发行。FlexTech旨在成为柔性电子技术领域学术平台的前瞻者,发表涉及柔性电子技术相关的材料、器件、制造及其在生命健康和工业领域应用的学术论文,展示连接基础研究和工程技术的高水平研究成果。

本刊特点:外文期刊,

柔性电子技术(英文)(FlexTech)(国际刊号)(OA期刊)

期刊基本信息

出版周期:不定期 级别:国际刊号
中国国内刊号:无CN刊号
国际标准刊号:ISSN 2771-1706;EISSN 2771-1714

杂志社联系方式

地址:北京市海淀区双清路学研大厦
邮编:100084
电话:010-83470584
官网邮箱:flextech@tup.tsinghua.edu.cn
官方网站:https://onlinelibrary.wiley.com/journal/27711714

杂志征稿投稿要求

投稿指南Author Guidelines

【杂志社官方网站信息】

Author Guidelines

Sections

Aims and Scope

Submission and Peer Review Process

Article Types

After Acceptance

1. Aims and Scope

FlexTech is a single-blind peer-reviewed, fully open access international journal co-published by Tsinghua University Press and Wiley, with the academic support provided by the Laboratory of Flexible Electronics Technology, Tsinghua University.

FlexTech aims at publishing experimental and theoretical research on flexible technologies with new materials, creative structures, original integrating strategies, innovative fabrication methods, and pioneering applications. FlexTech is the platform to gather and share inspiring findings and thoughts on emerging flexible technologies that act as the core and foundation for science and engineering.

The scope is internationally broad and interdisciplinary with emphases on fields including material science, electronics engineering, mechanics, physics, and chemistry. The journal recognizes the complexity of issues and therefore particularly welcomes innovative interdisciplinary research with wide impact. The scope includes but is not limited to the following:

Advanced materials for flexible devices; soft materials with unusual physical properties or functions; biomimetic soft materials.

Design of flexible, stretchable, and conformal structures for flexible devices; flexible structures with unconventional physical behaviors; three-dimensional electronics.

Novel fabrication, processing, and assembly techniques of flexible devices; large-scale manufacturing technologies of flexible systems and their core components.

Emerging applications of flexible technologies, e.g., biomedical engineering, healthcare, human–machine interface, Internet-of-Things.

Computational approaches and artificial intelligence for flexible technologies.

2. Submission and Peer Review Process

Thanks for your kind interest in FlexTech. The submissions have to consist of the content that has not been published or submitted for publication elsewhere except as a brief abstract in the proceedings of conferences or symposiums.

All the submissions will be handled and processed using the ScholarOne online submission system.

Once the submission materials have been prepared in accordance with the Author Guidelines, manuscripts should be submitted online at https://mc.manuscriptcentral.com/FlexTech

For help with submissions, please contact: flextech@tup.tsinghua.edu.cn

……

更多详情:

https://onlinelibrary.wiley.com/page/journal/27711714/homepage/author-guidelines

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